Advantest to Showcase Cutting-Edge Semiconductor Test Solutions at SEMICON Japan 2025
Event Overview
Advantest Corporation, a global leader in semiconductor test equipment, is set to unveil its latest innovations at SEMICON Japan 2025 in Tokyo. From December 17 to 19, the company will showcase a range of advanced test solutions designed for AI, high‑performance computing, and other cutting‑edge technologies.
Booth Details
The display will be located in East Hall 4 at booth #E4346. Visitors can explore technologies for applications such as AI, high‑performance computing (HPC), advanced memory, power electronics, automotive, and wireless communications.
Sponsorship and Partnerships
Advantest is a gold‑level sponsor of SEMICON Japan 2025 and is also sponsoring several key events, including the Advanced Packaging and Chiplet Summit (APCS), SEMI Technology Symposium (STS), AI × Sustainability × Semiconductor Summit, and a student event with Mirai College.
Presentations and Sessions
Beyond the product showcase, Advantest will deliver multiple presentations at APCS and STS covering AI and HPC, thermal test challenges, advanced packaging, and silicon photonics. The company is also invited to speak at ATS/ITC‑Asia 2025, held in conjunction with SEMICON Japan.
Commitment to Innovation
Advantest’s participation in SEMICON Japan 2025 underscores its commitment to innovation and its pivotal role in shaping the future of semiconductor technology.
